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Abstract #1290

Modeling PIN Diode Temperature Rise in High Induced Current MR Receive Coils

Robert Caverly 1 , Ronald Watkins 2 , and William E Doherty 3

1 Villanova University, Villanova, PA, United States, 2 Department of Radiology, Stanford University, Stanford, CA, United States, 3 Microsemi, Lowell, MA, United States

A new electrothermal SPICE-based model that predicts both electrical and thermal behavior of PIN diodes used in high field, high power MR imaging is described. The model accurately predicts the temperature rise in blocking applications and is fully compatible with industry-standard simulators such as SPICE as well as it variants. Knowledge of the temperature rise in PIN protection diodes is important because failure rates of these devices dramatically increase if temperatures exceed approximately 150 oC, with a potential loss of patient and equipment protection

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